- Series：
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- Length：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 19
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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|
|
Laird Technologies EMI |
405
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware，Rivet，Solder | ||
|
|
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Laird Technologies EMI |
97
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 19.81X609.6MM
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
|
- | 12.000" (304.80mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
|
All-Purpose | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDY,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNPB,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIB
|
Large Enclosure | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
