Scopri i prodotti 6
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Height Width Plating Plating - Thickness Attachment Method
0C97043802
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Large Enclosure 0.250" (6.35mm) 1.090" (27.69mm) - - Hardware,Rivet,Solder
0C97054217
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG COIL SNB PSA
Foldover 0.080" (2.03mm) 0.250" (6.35mm) Tin 299.21μin (7.60μm) Adhesive
0C97044017
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CSTR COIL SNB
Large Enclosure 0.410" (10.41mm) 1.630" (41.40mm) Tin 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97044018
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CSTR COIL NIE
Large Enclosure 0.410" (10.41mm) 1.630" (41.40mm) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C98044002
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CSTR COIL BF USF
Large Enclosure 0.410" (10.41mm) 1.630" (41.40mm) Unplated - Adhesive
0C97043816
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CSTR COIL ZNY
Large Enclosure 0.250" (6.35mm) 1.090" (27.69mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder