- Series:
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- Operating Temperature:
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- Height:
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- Length:
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- Width:
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- Plating - Thickness:
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- Attachment Method:
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- Condizioni selezionate:
Scopri i prodotti 173
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,STR,NIB,USFT
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,STR,NIE
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NID,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SQLN,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,NIE
|
- | 121°C | Fingerstock | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 0.347" (8.81mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NID,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | 0.104" (2.64mm) | 16.000" (406.40mm) | 0.357" (9.07mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NID,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,17S,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | 299.21μin (7.60μm) | Adhesive |