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- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 173
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL NIB
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP COIL NIB PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.067 X 0.177 NI 4.0--7-19PCI-NI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 4.000" (101.60mm) | 1.800" (45.72mm) | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,NID,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 X 0.23 NI 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL NIB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32AF-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 NI 16--11-32RH-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 NI 16 NTP--FOLDED SE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 NI 4.6--7-19PCI-NI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 4.600" (116.84mm) | 1.800" (45.72mm) | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.23 NI 24--3-23T-NI-24--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIB,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.08 NI 24--TWIST RIGHT A
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.080" (2.03mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.07 X 0.30 NI 24--6-30T-NI-24--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 NI 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 X 0.24 NI 16.0--FOLD
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.275 X 070 NI 16--TWIST
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 NI 24--6-34T-NI-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Flash | Adhesive |
