Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Length	Width	Plating	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Length	Width	Plating	Attachment Method
	97064502	Laird Technologies EMI	205	3 giorni	-	FINGERSTCK BECU ALY 5.33X609.6MM MOQ: 1 MPQ: 1	FINGERSTCK BECU ALY 5.33X609.6MM	-	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.210" (5.33mm)	-	Clip
	97064002	Laird Technologies EMI	143	3 giorni	-	FINGERSTOCK BECU 27.69X406.4MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 27.69X406.4MM	-	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.210" (5.33mm)	-	Clip
	97055802	Laird Technologies EMI	60	3 giorni	-	FINGERSTOCK BECU 2.79X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 2.79X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.200" (5.08mm)	-	Adhesive
	97055602	Laird Technologies EMI	63	3 giorni	-	FINGERSTOCK BECU 8.64X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 8.64X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.340" (8.64mm)	-	Adhesive
	97055902	Laird Technologies EMI	22	3 giorni	-	FINGRSTOCK BECU ALY 7.57X609.6MM MOQ: 1 MPQ: 1	FINGRSTOCK BECU ALY 7.57X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.300" (7.62mm)	-	Adhesive
	97056002	Laird Technologies EMI	inchiesta	-	-	FINGERSTOCK BECU 12.7X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 12.7X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.500" (12.70mm)	-	Adhesive
	0C97055902	Laird Technologies EMI	inchiesta	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.300" (7.62mm)	Unplated	Adhesive
	0C97055502	Laird Technologies EMI	inchiesta	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.340" (8.64mm)	Unplated	Adhesive
	0C98055902	Laird Technologies EMI	inchiesta	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.300" (7.62mm)	Unplated	Adhesive
	97056102	Laird Technologies EMI	inchiesta	-	-	FINGERSTOCK BECU 12.7X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 12.7X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.500" (12.70mm)	-	Adhesive
	6-30T-BD-24	Leader Tech Inc.	243	3 giorni	-	COPPER BERYLLIUM FINGERSTOCK EMI MOQ: 1 MPQ: 1	COPPER BERYLLIUM FINGERSTOCK EMI	-	-	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.300" (7.62mm)	-	-
	6-34T-SN-24	Leader Tech Inc.	99	3 giorni	-	COPPER BERYLLIUM FINGERSTOCK EMI MOQ: 1 MPQ: 1	COPPER BERYLLIUM FINGERSTOCK EMI	-	-	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.340" (8.64mm)	Tin	-
	98064502	Laird Technologies EMI	inchiesta	-	-	CLO,STR,DLN,BF,USFT MOQ: 1 MPQ: 1	CLO,STR,DLN,BF,USFT	-	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.210" (5.33mm)	-	Clip
	98055802	Laird Technologies EMI	inchiesta	-	-	TWT,STR,BF,USF,PSA MOQ: 1 MPQ: 1	TWT,STR,BF,USF,PSA	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.200" (5.08mm)	-	Adhesive
	98055902	Laird Technologies EMI	inchiesta	-	-	TWT,STR,BF,USF,PSA MOQ: 1 MPQ: 1	TWT,STR,BF,USF,PSA	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.300" (7.62mm)	-	Adhesive
	97056001	Laird Technologies EMI	inchiesta	-	-	TWT,STR,BF MOQ: 1 MPQ: 1	TWT,STR,BF	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.500" (12.70mm)	-	Adhesive
	98055547	Laird Technologies EMI	inchiesta	-	-	TWT,STR,SNB,USFT MOQ: 1 MPQ: 1	TWT,STR,SNB,USFT	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.340" (8.64mm)	-	Adhesive
	97056049	Laird Technologies EMI	inchiesta	-	-	TWT,STR,NIB MOQ: 1 MPQ: 1	TWT,STR,NIB	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.500" (12.70mm)	-	Adhesive
	98055801	Laird Technologies EMI	inchiesta	-	-	TWT,STR,BF,USFT MOQ: 1 MPQ: 1	TWT,STR,BF,USFT	Twist	121°C	Fingerstock	Beryllium Copper	-	24.000" (609.60mm)	0.200" (5.08mm)	-	Adhesive
	8-19PCI-SS-3.80	Leader Tech Inc.	inchiesta	-	-	0.067 X 0.19 SS 3.80--8-19PCI-SS MOQ: 1 MPQ: 1	0.067 X 0.19 SS 3.80--8-19PCI-SS	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	3.800" (96.52mm)	0.190" (4.83mm)	-	Adhesive

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