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Scopri i prodotti 123
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Attachment Method | |
|
|
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Laird Technologies EMI |
244
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.60MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
436
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 17X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | 0.670" (17.02mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
830
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 8.1X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | - | Adhesive | ||
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Laird Technologies EMI |
205
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3 giorni |
-
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MOQ: 1 MPQ: 1
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FINGERSTCK BECU ALY 5.33X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.210" (5.33mm) | - | Clip | ||
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Laird Technologies EMI |
359
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 27.94X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 1.100" (27.94mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
447
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | - | Adhesive | ||
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Laird Technologies EMI |
546
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU ALLOY 6X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
159
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.160" (4.06mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
134
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3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.500" (12.70mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
143
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3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.210" (5.33mm) | - | Clip | ||
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Laird Technologies EMI |
106
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3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.3X609.6MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
55
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3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.79X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.200" (5.08mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
75
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB 1/4X24X24
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ECCOSORB | - | Absorbing Sheet | Polyurethane Foam | Square | - | 24.000" (609.60mm) | - | - | ||
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|
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Laird Technologies EMI |
79
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||
|
|
|
Laird Technologies EMI |
63
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
71
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
22
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTOCK BECU ALY 7.57X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.300" (7.62mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.500" (12.70mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 18.29X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.209" (5.31mm) | 0.725" (18.42mm) | - | Adhesive |
