- Series:
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- Operating Temperature:
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- Height:
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- Length:
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- Width:
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- Plating:
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- Plating - Thickness:
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- Condizioni selezionate:
Scopri i prodotti 962
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 6.90--11-S-32AF-S
|
- | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 6.900" (175.26mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,STR,SNB,USFT
|
- | 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | Tin | 299.21μin (7.60μm) | Slot | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 47.625 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.30 SN 0.356--13-30RH-SN
|
- | -55°C ~ 121°C | Fingerstock | 0.130" (3.30mm) | 0.356" (9.04mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16 NTP--12-75RS-S
|
- | -55°C ~ 121°C | Fingerstock | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.750" (19.05mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
|
- | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.73--11-32RH-SN-
|
- | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIB
|
Large Enclosure | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 BD 15--11-35DT-BD-15
|
- | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Unplated | - | Adhesive |