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Scopri i prodotti 238
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Type | Frames per Second | Pixel Size | Active Pixel Array | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Type | Frames per Second | Pixel Size | Active Pixel Array | |
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OmniVision Technologies Inc |
2,500
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3 giorni |
-
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MOQ: 1 MPQ: 1
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SENSOR CAMERA CMOS 20CAMERACUBE
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Tape & Reel (TR) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
3,809
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SENSOR CAMERA CMOS 20CAMERACUBE
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Cut Tape (CT) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
3,809
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR CAMERA CMOS 20CAMERACUBE
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- | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
2,500
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tape & Reel (TR) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
7,123
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Cut Tape (CT) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
7,123
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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- | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
2,093
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE CMOS VGA 32-CSP3
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Tray | CameraChip，OmniPixel3-HS | 3.3V | -30°C ~ 70°C (TJ) | 32-CSP3 | - | CMOS | 30 | 4.2μm x 4.2μm | 656H x 488V | ||
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OmniVision Technologies Inc |
957
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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SENSOR IMAGE
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Tray | OmniBSI | 2.8V | - | - | 66-CSP3 (6.5x6) | CMOS with Processor | 15 | 1.75μm x 1.75μm | 2592H x 1944V | ||
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OmniVision Technologies Inc |
418
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tray | OmniBSI | 2.8V | -30°C ~ 70°C (TA) | - | 116-CSP3 | CMOS with Processor | 15 | 1.4μm x 1.4μm | 4416H x 3312V | ||
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OmniVision Technologies Inc |
319
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tray | OmniPixel3-HS | 3.3V | - | LGA | - | CMOS with Processor | 30 | 3μm x 3μm | 1280H x 800V | ||
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OmniVision Technologies Inc |
101
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniPixel3-HS | 3.3V | -20°C ~ 70°C (TA) | - | 62-aCSP (6.67 x 7.12) | CMOS with Processor | 30 | 6μm x 6μm | 752H x 480V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tape & Reel (TR) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
124
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Cut Tape (CT) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tape & Reel (TR) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
2,430
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Cut Tape (CT) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 23-WFBGA | 23-CSP3 (2.82x2.83) | CMOS | 30 | 2.5μm x 2.5μm | 640H x 480V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tray | OmniBSI | 2.8V | -30°C ~ 70°C (TJ) | 46-UFBGA，CSPBGA | 46-CSP3 (4.48x4.48) | CMOS with Processor | 30 | 1.75μm x 1.75μm | 1312H x 732V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tray | OmniBSI | 2.8V，3.3V | -30°C ~ 70°C (TA) | LGA | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 1296H x 808V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniPixel3-HS | 3.3V | -30°C ~ 85°C (TJ) | LGA | - | CMOS with Processor | 30 | 3μm x 3μm | 1280H x 800V | ||
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OmniVision Technologies Inc |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SENSOR IMAGE
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Tray | OmniPixel3 | 3.3V | -30°C ~ 70°C (TA) | - | 68-CSP3 (7.46 x 5.87) | CMOS with Processor | 30 | 3μm x 3μm | 1920H x 1080V |
