533002B02551G

descrizione :
HEATSINK TO-220 SOLDERPIN/CLIP
Attachment Method :
Clip and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
0.500" (12.70mm)
Length :
1.000" (25.40mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-220
Power Dissipation @ Temperature Rise :
2.0W @ 30°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
4.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
13.00°C/W
Type :
Board Level, Vertical
Width :
1.375" (34.93mm)

Prodotti simili