SMDLTLFP10T4

descrizione :
SOLDER PASTE LOW TEMP T4 10CC
Composition :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter :
-
Flux Type :
No-Clean
Form :
Syringe,10cc,35g (1.2 oz)
Melting Point :
281°F (138°C)
Process :
Lead Free
Series :
-
Shelf Life :
6 Months (Date of Manufacture) (Refrigerated)
Type :
Solder Paste
Wire Gauge :
-

Prodotti simili