L`immagine è solo un riferimento
506-AG11D-ESL-LF
- descrizione :
- CONN IC DIP SOCKET 6POS GOLD
- Questa parte è conforme alla normativa RoHS
- scheda tecnica (1)
- Aggiungi ai preferiti
- Aggiungi al confronto
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- Flash
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Nickel
- Features :
- Closed Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 6 (2 x 3)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 500
- Termination :
- Solder
- Type :
- DIP，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
