Xilinx Inc.

XC3S1400A-4FGG676C

descrizione :
IC FPGA 502 I/O 676FBGA
pacchetto :
676-FBGA (27x27)
Mounting Type :
Surface Mount
Number of Gates :
1400000
Number of I/O :
502
Number of LABs/CLBs :
2816
Number of Logic Elements/Cells :
25344
Operating Temperature :
0°C ~ 85°C (TJ)
Package / Case :
676-BGA
Series :
Spartan-3A
Supplier Device Package :
676-FBGA (27x27)
Total RAM Bits :
589824
Voltage - Supply :
1.14 V ~ 1.26 V

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