Scopri i prodotti 11
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Package / Case Supplier Device Package
XC3S1400AN-5FGG676C
Xilinx Inc.
234
3 giorni
-
MOQ: 1  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3AN 0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400A-4FGG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A 0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400AN-4FGG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3AN 0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400A-4FGG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A -40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400A-5FGG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A 0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400A-4FG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3S1400AN-4FGG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3AN -40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27)
XC3S1400AN-4FG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3AN 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3S1400A-4FG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3S1400A-5FG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3A 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3S1400AN-4FG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 502 I/O 676FBGA
Spartan-3AN -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)