- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Ethernet：
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- Security Features：
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- Condizioni selezionate:
Scopri i prodotti 463
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
325
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 133MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
361
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 50MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 50MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
1,822
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | 66MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | 133MHz | Communications; CPM | DRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
105
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | 133MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
298
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 50MHZ 256BGA
|
Tray | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | 50MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 66MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
112
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | 133MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
359
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | 66MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
124
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | 133MHz | Communications; CPM | DRAM | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 66MHz | Communications; CPM | DRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
103
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 133MHz | Communications; CPM | DRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
78
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 66MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
25
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 357BGA
|
Tray | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | 100MHz | Communications; CPM | DRAM | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
5
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 357BGA
|
Tray | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | 100MHz | Communications; CPM | DRAM | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
57
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 256BGA
|
Tray | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | 100MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 80MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 80MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
44
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 80MHZ 357BGA
|
Tray | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | 80MHz | Communications; CPM，Security; SEC | DRAM | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
18
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 256BGA
|
Tray | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | 100MHz | Communications; CPM | DRAM | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | 133MHz | Communications; CPM | DRAM | 10 Mbps (4)，10/100 Mbps (1) | - | - |
