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- Condizioni selezionate:
Scopri i prodotti 1,185
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Digi International |
583
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU RABBIT 60MHZ 128LQFP
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Tray | Rabbit | -55°C ~ 85°C (TA) | 128-LQFP | 128-LQFP (14x14) | Rabbit 4000 | 60MHz | 1 Core，8-Bit | - | - | No | - | 10 Mbps (1) | - | - | ||
|
|
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NXP USA Inc. |
734
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
440
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
305
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
368
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
98
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
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|
|
NXP USA Inc. |
325
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | - | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
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|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
79
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 333MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
361
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 50MHZ 256BGA
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Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 50MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
1,822
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
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|
|
NXP USA Inc. |
105
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 133MHz | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | - | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
101
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
75
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
298
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 50MHZ 256BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 50MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
184
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - |
