- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Condizioni selezionate:
Scopri i prodotti 95
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
440
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
1,376
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | - | SDRAM | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
265
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | - | SDRAM | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
26
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
12
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
80
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
39
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
57
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
58
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
19
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG |
