- Packaging：
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- Operating Temperature：
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- Supplier Device Package：
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- Core Processor：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- Ethernet：
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- Security Features：
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- Condizioni selezionate:
Scopri i prodotti 111
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
75
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
184
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
139
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
1,376
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 266MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
265
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 266MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
45
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 350MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 350MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
28
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 300MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
21
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
Intel |
2
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 200MHZ 520BGA
|
Tray | - | 0°C ~ 70°C (TA) | 520-LFBGA | 520-HL-PBGA (40x40) | StrongARM | 200MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
Intel |
3
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 232MHZ 520BGA
|
Tray | - | 0°C ~ 70°C (TA) | 520-LFBGA | 520-HL-PBGA (40x40) | StrongARM | 232MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
STMicroelectronics |
inchiesta
|
- |
-
|
MOQ: 504 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
Tray | - | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | 450MHz | 1 Core，32-Bit | ARM® Cortex®-M3 | Yes | LCD，Touchscreen | - | USB 2.0 (1) | - | ||
|
|
|
STMicroelectronics |
inchiesta
|
- |
-
|
MOQ: 1300 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
Tray | - | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | 450MHz | 1 Core，32-Bit | ARM® Cortex®-M3 | Yes | LCD，Touchscreen | - | USB 2.0 (1) | - | ||
|
|
|
STMicroelectronics |
inchiesta
|
- |
-
|
MOQ: 504 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
Tray | - | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | 450MHz | 1 Core，32-Bit | ARM® Cortex®-M3 | Yes | LCD，Touchscreen | - | USB 2.0 (1) | - | ||
|
|
|
Intel |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 432BGA
|
Tray | - | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 166MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
Intel |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 520BGA
|
Tray | - | 0°C ~ 70°C (TA) | 520-LFBGA | 520-HL-PBGA (40x40) | StrongARM | 166MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
Intel |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 432BGA
|
Tray | - | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 166MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
Intel |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 200MHZ 432BGA
|
Tray | - | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 200MHz | 1 Core，32-Bit | Data; Microengine | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 166MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 266MHz | 1 Core，32-Bit | - | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | 1 Core，32-Bit | - | No | - | - | - | - |
