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- Operating Temperature：
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- Supplier Device Package：
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- Voltage - I/O：
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- Condizioni selezionate:
Scopri i prodotti 27
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
150
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
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NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Cryptography |
