- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Ethernet:
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- Condizioni selezionate:
Scopri i prodotti 15
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | ||
NXP USA Inc. |
150
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 1 Core,32-Bit | - | DDR,DDR2 | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MIPS-I 267MHZ 128QFP
|
- | 0°C ~ 85°C (TC) | 128-BQFP | 128-PQFP (28x28) | MIPS-I | 3.3V | 1 Core,64-Bit | System Control; CP0 | DRAM | - | - | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MIPS-I 267MHZ 128QFP
|
- | 0°C ~ 85°C (TC) | 128-BQFP | 128-PQFP (28x28) | MIPS-I | 3.3V | 1 Core,64-Bit | System Control; CP0 | DRAM | - | - | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MIPS-I 267MHZ 208QFP
|
- | 0°C ~ 85°C (TC) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) | MIPS-I | 3.3V | 1 Core,64-Bit | System Control; CP0 | DRAM | - | - |