Scopri i prodotti 15
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Package / Case Supplier Device Package Core Processor Voltage - I/O Number of Cores/Bus Width Co-Processors/DSP RAM Controllers Ethernet USB
MPC8313CVRADDC
NXP USA Inc.
150
3 giorni
-
MOQ: 1  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313CZQADDC
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313CZQADD
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313ZQADD
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
KMPC8313CVRADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 2  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
KMPC8313VRADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 2  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
KMPC8313ZQADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 2  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313CVRADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313CZQADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX -40°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313VRADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313ZQADDB
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
MPC8313ZQADDC
NXP USA Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC MPU MPC83XX 267MHZ 516BGA
MPC83XX 0°C ~ 105°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) PowerPC e300c3 1.8V,2.5V,3.3V 1 Core,32-Bit - DDR,DDR2 10/100/1000 Mbps (2) USB 2.0 + PHY (1)
IDT79RV4640-267DU
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 24  MPQ: 1
IC MPU MIPS-I 267MHZ 128QFP
- 0°C ~ 85°C (TC) 128-BQFP 128-PQFP (28x28) MIPS-I 3.3V 1 Core,64-Bit System Control; CP0 DRAM - -
IDT79RV4640-267DUG
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 24  MPQ: 1
IC MPU MIPS-I 267MHZ 128QFP
- 0°C ~ 85°C (TC) 128-BQFP 128-PQFP (28x28) MIPS-I 3.3V 1 Core,64-Bit System Control; CP0 DRAM - -
IDT79RV4650-267DP
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 24  MPQ: 1
IC MPU MIPS-I 267MHZ 208QFP
- 0°C ~ 85°C (TC) 208-BFQFP Exposed Pad 208-PQFP (28x28) MIPS-I 3.3V 1 Core,64-Bit System Control; CP0 DRAM - -