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immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Height Length Width Plating Plating - Thickness Attachment Method
6-31CPG-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.06 X 0.305 BD 16--6-31CPG-BD-1
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) 16.000" (406.40mm) 0.310" (7.87mm) Unplated - Adhesive
98091902
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
S3,STR,BF,USFT,RIV
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) - - Rivet
41-163FSDS-BD-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.41 X 1.63 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.410" (10.41mm) 16.000" (406.40mm) 1.630" (41.40mm) Unplated - Adhesive
14-38AH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.14 X 0.38 SN 16--14-38AH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.140" (3.56mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin Flash Adhesive
3-23T-SNPB-24-NTP
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.03 X 0.23 SNPB 24 NTP--3-23T-S
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Lead,Tin Flash Adhesive
25-78FS-SU-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 0.78 SU 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated - Adhesive
25-78FSV50-SU-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 0.78 X 0.50 SU 24--FOLDED
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated - Adhesive
6-45LPH-060-ZNC-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.06 X 0.45 X 060 ZNC 16--6-45LP
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) 16.000" (406.40mm) 0.450" (11.43mm) Zinc + Clear Chromate Flash Adhesive
97036008
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
CSTR,PCS,SNSAT
- - - - - - - - - -
16-44UD-MAG-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.16 X 0.44 MAG 16--16-44UD-MAG-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.016" (0.41mm) 16.000" (406.40mm) 0.440" (11.18mm) Silver Flash Adhesive
13-28U-MAG-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.281 MAG 16--13-28U-MAG-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.130" (3.30mm) 16.000" (406.40mm) 0.280" (7.11mm) Silver Flash Adhesive
41-113FSV-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.41 X 1.13 X SN 16--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.410" (10.41mm) 16.000" (406.40mm) 1.130" (28.70mm) Tin Flash Adhesive
6000-0025-71
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
.250" X 50 LONG TECHMESH TAPE--
- - Gasket Sleeve - - - 0.250" (6.35mm) Tin - -
2040001600
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
SHLD,STR,BECU,AG
- - - - - - - - - -
6-31CPG-SNPB-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.06 X 0.305 SNPB 16.0--6-31CPG-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) 16.000" (406.40mm) 0.310" (7.87mm) Lead,Tin Flash Adhesive
0097056717T01524
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
TWT,STR,SNB,PSA,CTL 6"
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8402010242
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
AMR,MON,RL
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8-19PCI-NI-18
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.067 X 0.19 NI 18--8-19PCI-NI-1
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) 18.000" (457.20mm) 0.190" (4.83mm) Nickel Flash Adhesive
4833AC51K06225
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 REC
- - - - - - - - - -
6-50T2-ST-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.06 X 0.50 ST 24--TWIST DOUBLE
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.500" (12.70mm) Tin Flash Adhesive