Scopri i prodotti 18
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Length Width Plating Plating - Thickness Attachment Method
S0981-46R
Harwin Inc.
78,000
3 giorni
-
MOQ: 1  MPQ: 1
RFI SHIELD CLIP R/A TIN SMD
- -25°C ~ 150°C Shield Clip Stainless Steel 0.185" (4.70mm) 0.031" (0.80mm) Tin 118.11μin (3.00μm) Solder
S0981-46R
Harwin Inc.
81,078
3 giorni
-
MOQ: 1  MPQ: 1
RFI SHIELD CLIP R/A TIN SMD
- -25°C ~ 150°C Shield Clip Stainless Steel 0.185" (4.70mm) 0.031" (0.80mm) Tin 118.11μin (3.00μm) Solder
S0981-46R
Harwin Inc.
81,078
3 giorni
-
MOQ: 1  MPQ: 1
RFI SHIELD CLIP R/A TIN SMD
- -25°C ~ 150°C Shield Clip Stainless Steel 0.185" (4.70mm) 0.031" (0.80mm) Tin 118.11μin (3.00μm) Solder
1053840002
Molex,LLC
64,000
3 giorni
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.70MM - 1.10MM H
- - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.685μin (0.50μm) Solder
1053840002
Molex,LLC
72,070
3 giorni
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.70MM - 1.10MM H
- - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.685μin (0.50μm) Solder
1053840002
Molex,LLC
72,070
3 giorni
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.70MM - 1.10MM H
- - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.685μin (0.50μm) Solder
1053840003
Molex Connector Corporation
inchiesta
-
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.30MM - 0.55MM H
105384 - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.7μin (0.50μm) Solder
1053840003
Molex Connector Corporation
6,551
3 giorni
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.30MM - 0.55MM H
105384 - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.7μin (0.50μm) Solder
1053840003
Molex Connector Corporation
6,551
3 giorni
-
MOQ: 1  MPQ: 1
SPRING CONTACT 0.30MM - 0.55MM H
105384 - Shield Finger,Pre-Loaded Stainless Steel 0.154" (3.90mm) 0.087" (2.20mm) Gold 19.7μin (0.50μm) Solder
97052702
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
- 121°C Fingerstock Beryllium Copper 16.000" (406.40mm) 0.280" (7.11mm) - - Adhesive
0D97065402
Laird Technologies EMI
1
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.6X304.8MM
- - Fingerstock Beryllium Copper 12.000" (304.80mm) 0.183" (4.65mm) Unplated - Clip
2108610-5
TE Connectivity AMP Connectors
inchiesta
-
-
MOQ: 1  MPQ: 1
1.4H SPRING FINGER W/EMBOSS
- - Shield Finger,Pre-Loaded Copper Alloy 0.118" (3.00mm) 0.039" (1.00mm) Gold Flash Solder
2108610-5
TE Connectivity AMP Connectors
9,530
3 giorni
-
MOQ: 1  MPQ: 1
1.4H SPRING FINGER W/EMBOSS
- - Shield Finger,Pre-Loaded Copper Alloy 0.118" (3.00mm) 0.039" (1.00mm) Gold Flash Solder
1-1447360-1
TE Connectivity AMP Connectors
inchiesta
-
-
MOQ: 1  MPQ: 1
SHIELDFINGER1410
- - Shield Finger,Pre-Loaded Copper Alloy 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
1-1447360-1
TE Connectivity AMP Connectors
inchiesta
-
-
MOQ: 1  MPQ: 1
SHIELDFINGER1410
- - Shield Finger,Pre-Loaded Copper Alloy 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
1-1447360-1
TE Connectivity AMP Connectors
inchiesta
-
-
MOQ: 1  MPQ: 1
SHIELDFINGER1410
- - Shield Finger,Pre-Loaded Copper Alloy 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
97052717
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
AP,STR,SNB,PSA
- 121°C Fingerstock Beryllium Copper 16.000" (406.40mm) 0.280" (7.11mm) Tin 299.21μin (7.60μm) Adhesive
2108610-6
TE Connectivity AMP Connectors
inchiesta
-
-
MOQ: 1  MPQ: 1
1.4H SPRING FINGER WITH EMBOSS
- - Shield Finger,Pre-Loaded Copper Alloy 0.114" (2.90mm) 0.039" (1.00mm) Gold 15.748μin (0.40μm) Solder