- Operating Temperature:
-
- Length:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
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- Attachment Method:
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- Condizioni selezionate:
Scopri i prodotti 15
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Harwin Inc. |
78,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
81,078
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
81,078
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Molex,LLC |
64,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Molex,LLC |
72,070
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Molex,LLC |
72,070
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
121°C | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | Fingerstock | Beryllium Copper | 12.000" (304.80mm) | 0.183" (4.65mm) | Unplated | - | Clip | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER W/EMBOSS
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.118" (3.00mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
9,530
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER W/EMBOSS
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.118" (3.00mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
121°C | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER WITH EMBOSS
|
- | Shield Finger,Pre-Loaded | Copper Alloy | 0.114" (2.90mm) | 0.039" (1.00mm) | Gold | 15.748μin (0.40μm) | Solder |