- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 26
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
134
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3 giorni |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.87X37.59MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 1.480" (37.59mm) | 0.310" (7.87mm) | - | - | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.347" (8.81mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGRSTK BECU ALY 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.78mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,6F,BF,USFT
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.980" (24.89mm) | 0.310" (7.87mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT COIL ZNC PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.500" (12.70mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,NIB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.347" (8.81mm) | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,TLN,SNB,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.87X12.19MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.480" (12.19mm) | 0.310" (7.87mm) | - | - | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.87X50.29MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 1.980" (50.29mm) | 0.310" (7.87mm) | - | - | Slot | ||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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.120"H X .155"W X 16.00"L--RECTA
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 16.000" (406.40mm) | 0.155" (3.94mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.75 SN 16 NTP--12-75RS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.750" (19.05mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL SNB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive |
