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- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 17
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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FINGRSTK BECU ALY 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.440" (11.78mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,TLN,SNB,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,SNB,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.120"H X .155"W X 16.00"L--RECTA
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.155" (3.94mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.75 SN 16 NTP--12-75RS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL SNB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.60 BD 16--12-60LPAH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.75 BD 16--12-75RS-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.60 SN 16--12-60LPAH-SN-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.600" (15.24mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.75 SN 16--12-75RS-SN-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Tin | Flash | Adhesive |
