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Scopri i prodotti 26
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,NIB,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.60 BD 16--12-60LPAH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.75 BD 16--12-75RS-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.750" (19.05mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.60 SN 16--12-60LPAH-SN-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16--12-75RS-SN-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.750" (19.05mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.120"H X .150"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 24.000" (609.60mm) | 0.150" (3.81mm) | - | - | - |
