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- Operating Temperature：
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Scopri i prodotti 144
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU V0 CSH
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | C-Fold | 0.413" (10.50mm) | 0.449" (11.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU PTAF PU NR REC
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- | - | Fabric Over Foam | - | Rectangle | 0.512" (13.00mm) | 0.984" (25.00mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CSH
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | C-Fold | 0.252" (6.40mm) | 0.280" (7.10mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 DSH
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.500" (12.70mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
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- | - | - | - | - | - | 0.062" (1.59mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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DES,STR,NIE,CLO
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- | - | - | - | - | - | 0.062" (1.59mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
DES,STR,NIB,CLO
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- | - | - | - | - | - | 0.062" (1.59mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | - | - | 0.183" (4.65mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CSH
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | C-Fold | 0.465" (11.80mm) | 0.421" (10.70mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
DES,STR,ZNC,CLO
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- | - | - | - | - | - | 0.183" (4.65mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CSH
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | C-Fold | 0.673" (17.10mm) | 0.591" (15.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU CF PROF V0
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- | - | Fabric Over Foam | - | - | 0.060" (1.52mm) | 5.000" (127.00mm) | - | - | - | ||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.080"H X 394"W X 12"L--D SHAPED-
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.080" (2.03mm) | 0.394" (10.01mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.180"H X 400"W X 12"L--D SHAPED-
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.180" (4.57mm) | 0.400" (10.16mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.040"H X .200"W X 12"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.040" (1.02mm) | 0.200" (5.08mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.23 BD 12.0--3-23T-BD-12
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.07 X 0.13 BD 12--7-13U-BD-12--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.130" (3.30mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.41 X 1.13 BD 12--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive |
