- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 422
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,BF,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.440" (11.18mm) | - | - | Clip | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Slot | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,BF,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.104" (2.64mm) | 0.357" (9.07mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SQLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SQLN,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.440" (11.18mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STRSNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.174" (4.42mm) | 0.357" (9.07mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,NIE
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNSAT,DLN
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,ZNC
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Clip |
