- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 422
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,SNB
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,DLN,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.300" (7.62mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,SQLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.300" (7.62mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.300" (7.62mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB,TLN
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.190" (4.83mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.190" (4.83mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CSH
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | C-Fold | 0.413" (10.50mm) | 0.449" (11.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.179" (4.55mm) | 0.511" (12.98mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NID,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.104" (2.64mm) | 0.357" (9.07mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,ZNC,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,SNB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.217" (5.50mm) | 0.709" (18.00mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.200" (5.08mm) | 0.380" (9.65mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.200" (5.08mm) | 0.380" (9.65mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.330" (8.38mm) | - | - | Clip | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | - | - | Adhesive |
