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Scopri i prodotti 44
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF USFT PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
10
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3 giorni |
-
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MOQ: 1 MPQ: 1
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EMI FABRIC GASKET 1.52X7.11MM
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Ripstop (NI/CU) | Rectangular | 0.060" (1.52mm) | 23.62" (599.95mm) | - | - | Non-Conductive Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.060"H X .280"W X 48"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 4.00 (1.22m) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 X 0.23 NI 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 NI 16 NTP--FOLDED SE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 BD 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 BD 16.0--FOLD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 SN 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 SN 16.0--FOLD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 NI 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 NI 16.0--FOLD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive |
