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- Condizioni selezionate:
Scopri i prodotti 48
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
491
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
483
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.35X406.4MM
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- | - | - | - | - | - | 16.000" (406.40mm) | - | - | - | ||
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Leader Tech Inc. |
68
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FSG，.187"H X .25"W X 48"L
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- | - | Fabric Over Foam | - | D-Shape | 0.187" (4.75mm) | 48.000" (121.90cm) | - | - | - | ||
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Laird Technologies EMI |
25
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3 giorni |
-
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MOQ: 1 MPQ: 1
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MF LOAD SERIES 1/4X12
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ECCOSORB | - | Absorbing Sheet | - | Round | - | 12.000" (304.80mm) | - | - | - | ||
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Laird Technologies EMI |
15
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
RFI EMI SHIELDING MATERIAL
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- | - | - | - | Rectangular | - | 16" (406.40mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
MF LOAD SERIES 1/4X12
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ECCOSORB | - | Fabric Over Foam | - | Round | - | 12.008" (305.00mm) | - | - | - | ||
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Leader Tech Inc. |
93
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | |||
|
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Leader Tech Inc. |
2
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.25" OD,
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- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
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Leader Tech Inc. |
2
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
M83528/009B006，AG/AL FILLED SIL
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- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
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Leader Tech Inc. |
5
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
M83528/009D006，AG/AL FILLED FLO
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- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
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Leader Tech Inc. |
6
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
M83528/011B003，AG/AL FILLED SIL
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- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
|
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Leader Tech Inc. |
2
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
M83528/011D003，AG/AL FILLED FLO
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
|
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Leader Tech Inc. |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.25" X .0
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,BF
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 25.000 (7.62m) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
