Scopri i prodotti 19
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Height Plating Plating - Thickness Attachment Method
97054202
Laird Technologies EMI
491
3 giorni
-
MOQ: 1  MPQ: 1
GASKET BECU ALLOY 6.35X406.4MM
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) - - Adhesive
97065602
Laird Technologies EMI
483
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 6.35X406.4MM
- - - - - - - -
98054202
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTCK ULTRASFT 6.35X406.4MM
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) - - -
8-25FSC-BD-16
Leader Tech Inc.
93
3 giorni
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper 0.080" (2.03mm) - - -
0C97054202
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG COIL BF PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Unplated - Adhesive
97054201
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,BF
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) - - Adhesive
97054215
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,ZNC,PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Zinc + Clear Chromate 299.21μin (7.60μm) Adhesive
97054217
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,SNB,PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Tin 299.21μin (7.60μm) Adhesive
97054219
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,NIB,PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Nickel 299.21μin (7.60μm) Adhesive
0C98054202
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG COIL BF USF PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Unplated - Adhesive
0C97054216
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG COIL ZNY PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Adhesive
0C97054219
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG COIL NIB PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Nickel 299.21μin (7.60μm) Adhesive
98054217
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,SNB,USF,PSA
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Tin 299.21μin (7.60μm) Adhesive
98054201
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,BF,USFT
Foldover 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) - - -
7-21C-045-DL-CDC-16
Leader Tech Inc.
inchiesta
-
-
MOQ: 1  MPQ: 1
0.07 X .25 X 045 CDC 16--7-21C-0
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) Cadmium + Clear Chromate Flash Adhesive
7-21C-045-DL-BD-16
Leader Tech Inc.
inchiesta
-
-
MOQ: 1  MPQ: 1
0.07 X .25 X 045 BD 16--7-21C-04
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) Unplated - Adhesive
8-25FSC-SN-16
Leader Tech Inc.
inchiesta
-
-
MOQ: 1  MPQ: 1
0.08 X 0.25 SN 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) Tin Flash Adhesive
7-21C-045-DL-SN-16
Leader Tech Inc.
inchiesta
-
-
MOQ: 1  MPQ: 1
0.07 X .25 X 045 SN 16--7-21C-04
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) Tin Flash Adhesive
7-21C-045-DL-NI-16
Leader Tech Inc.
inchiesta
-
-
MOQ: 1  MPQ: 1
0.07 X .25 X 045 NI 16--7-21C-04
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) Nickel Flash Adhesive