fabbricante:
Operating Temperature:
Length:
Width:
Scopri i prodotti 891
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Material Height Length Width Plating Plating - Thickness Attachment Method
10-26UD-AU-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.11 X 0.26 AU 16--10-26UD-AU-16
TechMESH -55°C ~ 121°C Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.260" (6.60mm) Gold Flash Adhesive
11-S-32AH-AU-16
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.11 X 0.32 AU 16--11-S-32AH-AU-
- -55°C ~ 121°C Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.320" (8.13mm) Gold Flash Adhesive
14-37FS-BD-300""
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.14 X 0.36 BD 300"--FOLDED SERI
- -55°C ~ 121°C Beryllium Copper 0.140" (3.56mm) 25.00 (7.62m) 0.370" (9.40mm) Unplated - Adhesive
3-23TV30-SN-300""
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.03 X 0.08 SN 300--TWIST RIGHT
- -55°C ~ 121°C Beryllium Copper 0.030" (0.76mm) 25.00 (7.62m) 0.080" (2.03mm) Tin Flash Adhesive
6-34T-BD-300
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.07 X 0.34 BD 300--6-34T-BD-300
- -55°C ~ 121°C Beryllium Copper 0.070" (1.78mm) 25.00 (7.62m) 0.340" (8.64mm) Unplated - Adhesive
23-60FS-BD-400
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 400--FOLDED SERIE
- -55°C ~ 121°C Beryllium Copper 0.230" (5.84mm) 33.33 (10.16m) 0.600" (15.24mm) Unplated - Adhesive
25-109FSDS-SN-300""
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 SN 300"--FOLDED SERI
- -55°C ~ 121°C Beryllium Copper 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Tin Flash Adhesive
25-109FSDS-BD-300
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 BD 300"--FOLDED SERI
- -55°C ~ 121°C Beryllium Copper 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated - Adhesive
25-78FS-BD-300
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 0.78 BD 300"--FOLDED SERI
- -55°C ~ 121°C Beryllium Copper 0.250" (6.35mm) 25.00 (7.62m) 0.780" (19.81mm) Unplated - Adhesive
8-25FSC-BD-400
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.08 X 0.25 BD 400--FOLDED SERIE
- -55°C ~ 121°C Beryllium Copper 0.080" (2.03mm) 33.33 (10.16m) 0.250" (6.35mm) Unplated - Adhesive
0C97052005
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
AP COIL CDY PSA
All-Purpose 121°C Beryllium Copper 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Cadmium + Yellow Chromate 299.21μin (7.60μm) Adhesive