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Scopri i prodotti 557
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,ZNC,RA,PSA
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Twist | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT,17S,NIB,PSA
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- | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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LS,STR,SNB,CLO
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- | Beryllium Copper | 0.176" (4.47mm) | 17.000" (433.22mm) | 0.295" (7.49mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF
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Foldover | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF,USF,PSA
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF,USF,PSA
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,SNB,PSA
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,SNB
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
TWT,STR,BF
|
Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
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Twist | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,USFT,PSA
|
Twist | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
|
Twist | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,USFT,PSA
|
Twist | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,CLO
|
- | Beryllium Copper | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.150" (3.81mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,PSA
|
Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
STS3,STR,ZNC,PSA
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIE,PSA
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,PSA
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
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- | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.60m) | 1.630" (41.40mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive |
