Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
	97077807	Laird Technologies EMI	inchiesta	-	-	DCON,9P,SNPB MOQ: 1 MPQ: 1	DCON,9P,SNPB	-	Beryllium Copper	0.025" (0.64mm)	1.410" (35.81mm)	0.690" (17.53mm)	Lead，Tin	299.21μin (7.60μm)	Slot
	97078000	Laird Technologies EMI	inchiesta	-	-	DCON,25P,BF MOQ: 1 MPQ: 1	DCON,25P,BF	-	Beryllium Copper	0.025" (0.64mm)	2.280" (57.91mm)	0.690" (17.53mm)	-	-	Slot
	0C98055017	Laird Technologies EMI	inchiesta	-	-	TWT COIL SNB USF PSA MOQ: 1 MPQ: 1	TWT COIL SNB USF PSA	Twist	Beryllium Copper	0.030" (0.76mm)	24.000" (609.60mm)	0.230" (5.84mm)	Tin	299.21μin (7.60μm)	Adhesive
	0C98055015	Laird Technologies EMI	inchiesta	-	-	TWT COIL ZNC USFT PSA MOQ: 1 MPQ: 1	TWT COIL ZNC USFT PSA	Twist	Beryllium Copper	0.030" (0.76mm)	24.000" (609.60mm)	0.230" (5.84mm)	Zinc + Clear Chromate	299.21μin (7.60μm)	Adhesive
	77003102	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 20.32X27.76MM MOQ: 1 MPQ: 1	GASKET BECU 20.32X27.76MM	Slot Mount	Beryllium Copper	0.320" (8.13mm)	1.093" (27.76mm)	0.800" (20.32mm)	-	-	Slot
	77003202	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 20.32X37.3MM MOQ: 1 MPQ: 1	GASKET BECU 20.32X37.3MM	Slot Mount	Beryllium Copper	0.320" (8.13mm)	1.468" (37.29mm)	0.800" (20.32mm)	-	-	Slot
	77003502	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 7.87X12.19MM MOQ: 1 MPQ: 1	GASKET BECU 7.87X12.19MM	Slot Mount	Beryllium Copper	0.120" (3.05mm)	0.480" (12.19mm)	0.310" (7.87mm)	-	-	Slot
	77003802	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 7.87X50.29MM MOQ: 1 MPQ: 1	GASKET BECU 7.87X50.29MM	Slot Mount	Beryllium Copper	0.120" (3.05mm)	1.980" (50.29mm)	0.310" (7.87mm)	-	-	Slot
	77008702	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 14.3X32.77MM MOQ: 1 MPQ: 1	GASKET BECU 14.3X32.77MM	Slot Mount	Beryllium Copper	0.110" (2.79mm)	1.291" (32.79mm)	0.563" (14.30mm)	-	-	Slot
	77010002	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 15.24X42.16MM MOQ: 1 MPQ: 1	GASKET BECU 15.24X42.16MM	Slot Mount	Beryllium Copper	0.220" (5.59mm)	1.660" (42.16mm)	0.600" (15.24mm)	-	-	Slot
	0C78001002	Laird Technologies EMI	inchiesta	-	-	GASKET ULTRASOFT 8.1MMX7.6M MOQ: 1 MPQ: 1	GASKET ULTRASOFT 8.1MMX7.6M	Slot Mount	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.320" (8.13mm)	Unplated	-	Slot
	0C77001017	Laird Technologies EMI	inchiesta	-	-	GASKET BECU 8.1MMX7.6M MOQ: 1 MPQ: 1	GASKET BECU 8.1MMX7.6M	Slot Mount	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.320" (8.13mm)	Tin	299.21μin (7.60μm)	Slot
	0C78001017	Laird Technologies EMI	inchiesta	-	-	GASKET ULTRASOFT 8.1MMX7.6M MOQ: 1 MPQ: 1	GASKET ULTRASOFT 8.1MMX7.6M	Slot Mount	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.320" (8.13mm)	Tin	299.21μin (7.60μm)	Slot
	0C78001019	Laird Technologies EMI	inchiesta	-	-	GASKET ULTRASOFT 8.1MMX7.6M MOQ: 1 MPQ: 1	GASKET ULTRASOFT 8.1MMX7.6M	Slot Mount	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.320" (8.13mm)	Nickel	299.21μin (7.60μm)	Slot
	0C97055008	Laird Technologies EMI	inchiesta	-	-	TWT COIL SNSAT PSA MOQ: 1 MPQ: 1	TWT COIL SNSAT PSA	Twist	Beryllium Copper	0.030" (0.76mm)	24.000" (609.60mm)	0.230" (5.84mm)	Tin	299.21μin (7.60μm)	Adhesive
	0C97055017	Laird Technologies EMI	inchiesta	-	-	TWT COIL SNB PSA MOQ: 1 MPQ: 1	TWT COIL SNB PSA	Twist	Beryllium Copper	0.030" (0.76mm)	24.000" (609.60mm)	0.230" (5.84mm)	Tin	299.21μin (7.60μm)	Adhesive
	78007517	Laird Technologies EMI	inchiesta	-	-	SLMT,STR,SNB,USFT MOQ: 1 MPQ: 1	SLMT,STR,SNB,USFT	-	Beryllium Copper	0.100" (2.54mm)	16.000" (406.40mm)	0.325" (8.26mm)	Tin	299.21μin (7.60μm)	Slot
	0C97055508	Laird Technologies EMI	inchiesta	-	-	TWT COIL SNSAT PSA MOQ: 1 MPQ: 1	TWT COIL SNSAT PSA	Twist	Beryllium Copper	0.070" (1.78mm)	24.000" (609.60mm)	0.340" (8.64mm)	Tin	299.21μin (7.60μm)	Adhesive
	0C97055517	Laird Technologies EMI	inchiesta	-	-	TWT COIL SNB PSA MOQ: 1 MPQ: 1	TWT COIL SNB PSA	Twist	Beryllium Copper	0.070" (1.78mm)	24.000" (609.60mm)	0.340" (8.64mm)	Tin	299.21μin (7.60μm)	Adhesive
	98050017	Laird Technologies EMI	inchiesta	-	-	HDWE GROUNDING STRIP MOQ: 1 MPQ: 1	HDWE GROUNDING STRIP	-	Beryllium Copper	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Tin	299.21μin (7.60μm)	Adhesive

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