Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
	0C97054216	Laird Technologies EMI	inchiesta	-	-	NOSG COIL ZNY PSA MOQ: 1 MPQ: 1	NOSG COIL ZNY PSA	Foldover	Beryllium Copper	0.080" (2.03mm)	16.000" (406.40mm)	0.250" (6.35mm)	Zinc + Yellow Chromate	299.21μin (7.60μm)	Adhesive
	0C97054219	Laird Technologies EMI	inchiesta	-	-	NOSG COIL NIB PSA MOQ: 1 MPQ: 1	NOSG COIL NIB PSA	Foldover	Beryllium Copper	0.080" (2.03mm)	16.000" (406.40mm)	0.250" (6.35mm)	Nickel	299.21μin (7.60μm)	Adhesive
	98054002	Laird Technologies EMI	inchiesta	-	-	AP,STR,BF,USF,PSA MOQ: 1 MPQ: 1	AP,STR,BF,USF,PSA	-	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.280" (7.11mm)	-	-	Adhesive
	0C97050017	Laird Technologies EMI	inchiesta	-	-	AP COIL SNB PSA MOQ: 1 MPQ: 1	AP COIL SNB PSA	All-Purpose	Beryllium Copper	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052102	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,BF,USFT,PSA MOQ: 1 MPQ: 1	NOSG,STR,BF,USFT,PSA	Foldover	Beryllium Copper	0.140" (3.56mm)	16.000" (406.40mm)	0.510" (12.95mm)	-	-	Adhesive
	98095517	Laird Technologies EMI	inchiesta	-	-	S3,STR,SNB,USFT,RIV MOQ: 1 MPQ: 1	S3,STR,SNB,USFT,RIV	-	Beryllium Copper	0.140" (3.56mm)	15.000" (381.00mm)	0.450" (11.43mm)	Tin	299.21μin (7.60μm)	Adhesive
	98095115	Laird Technologies EMI	inchiesta	-	-	S3,STR,ZNC,USFT,PSA MOQ: 1 MPQ: 1	S3,STR,ZNC,USFT,PSA	-	Beryllium Copper	0.220" (5.59mm)	15.000" (381.00mm)	0.620" (15.75mm)	Zinc + Clear Chromate	299.21μin (7.60μm)	Adhesive
	98052002	Laird Technologies EMI	inchiesta	-	-	AP,STR,BF,USF,PSA MOQ: 1 MPQ: 1	AP,STR,BF,USF,PSA	-	Beryllium Copper	0.140" (3.56mm)	16.000" (406.40mm)	0.370" (9.40mm)	-	-	Adhesive
	0C98050002	Laird Technologies EMI	inchiesta	-	-	AP COIL BF USFT PSA MOQ: 1 MPQ: 1	AP COIL BF USFT PSA	All-Purpose	Beryllium Copper	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Unplated	-	Adhesive
	98091016	Laird Technologies EMI	inchiesta	-	-	STS3,STR,ZNY,USFT MOQ: 1 MPQ: 1	STS3,STR,ZNY,USFT	-	Beryllium Copper	0.220" (5.59mm)	15.000" (381.00mm)	0.620" (15.75mm)	Zinc + Yellow Chromate	299.21μin (7.60μm)	Adhesive
	98065502	Laird Technologies EMI	inchiesta	-	-	PCLIP,STR,BF,USFT,CLO MOQ: 1 MPQ: 1	PCLIP,STR,BF,USFT,CLO	-	Beryllium Copper	0.305" (7.75mm)	11.945" (303.40mm)	-	-	-	Clip
	98051502	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,BF,USF,PSA MOQ: 1 MPQ: 1	NOSG,STR,BF,USF,PSA	Foldover	Beryllium Copper	0.230" (5.84mm)	24.000" (609.60mm)	0.760" (19.30mm)	-	299.21μin (7.60μm)	Adhesive
	98054217	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,SNB,USF,PSA MOQ: 1 MPQ: 1	NOSG,STR,SNB,USF,PSA	Foldover	Beryllium Copper	0.080" (2.03mm)	16.000" (406.40mm)	0.250" (6.35mm)	Tin	299.21μin (7.60μm)	Adhesive
	98055502	Laird Technologies EMI	inchiesta	-	-	FINGERSTCK ULTRASFT 8.64X609.6MM MOQ: 1 MPQ: 1	FINGERSTCK ULTRASFT 8.64X609.6MM	Twist	Beryllium Copper	0.070" (1.78mm)	24.000" (609.60mm)	0.340" (8.64mm)	-	-	-
	98095802	Laird Technologies EMI	inchiesta	-	-	S3,STR,BF,USFT,RIV MOQ: 1 MPQ: 1	S3,STR,BF,USFT,RIV	-	Beryllium Copper	0.110" (2.79mm)	15.000" (381.00mm)	0.350" (8.89mm)	-	-	Adhesive
	98054117	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,SNB,USF,PSA MOQ: 1 MPQ: 1	NOSG,STR,SNB,USF,PSA	Foldover	Beryllium Copper	0.120" (3.05mm)	16.000" (406.40mm)	0.380" (9.65mm)	Tin	299.21μin (7.60μm)	Adhesive
	98054119	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,NIB,USF,PSA MOQ: 1 MPQ: 1	NOSG,STR,NIB,USF,PSA	Foldover	Beryllium Copper	0.120" (3.05mm)	16.000" (406.40mm)	0.380" (9.65mm)	Nickel	299.21μin (7.60μm)	Adhesive
	98095502	Laird Technologies EMI	inchiesta	-	-	S3,STR,BF,USF,RIV MOQ: 1 MPQ: 1	S3,STR,BF,USF,RIV	-	Beryllium Copper	0.140" (3.56mm)	15.000" (381.00mm)	0.450" (11.43mm)	-	-	Adhesive
	0C97052117	Laird Technologies EMI	inchiesta	-	-	NOSG COIL SNB PSA MOQ: 1 MPQ: 1	NOSG COIL SNB PSA	Foldover	Beryllium Copper	0.140" (3.56mm)	16.000" (406.40mm)	0.510" (12.95mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052017	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,USFT,PSA MOQ: 1 MPQ: 1	AP,STR,SNB,USFT,PSA	-	Beryllium Copper	0.140" (3.56mm)	16.000" (406.40mm)	0.370" (9.40mm)	Tin	299.21μin (7.60μm)	Adhesive

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