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- Operating Temperature:
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- Material:
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- Shape:
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- Height:
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- Plating - Thickness:
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- Condizioni selezionate:
Scopri i prodotti 332
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 24.000" (609.60mm) | 0.195" (4.95mm) | 299.21μin (7.60μm) | Snap-In | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | 299.21μin (7.60μm) | Snap-In | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | 24.000" (609.60mm) | 0.670" (17.02mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNSAT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,15P,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 1.740" (44.20mm) | 0.690" (17.53mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.260" (6.60mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Rivet | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.356--11-32RH-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.156" DIA ROUND ALL MESH--7000-0
|
- | - | Gasket | - | Round | - | - | 0.156" (3.96mm) | - | - | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.917--11-S-32AF-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.917" (23.29mm) | 0.320" (8.13mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.54--11-32RH-SN-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.540" (13.72mm) | 0.320" (8.13mm) | Flash | Adhesive |