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- Operating Temperature：
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- Material：
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- Height：
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- Condizioni selezionate:
Scopri i prodotti 332
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,SNB,PSA
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
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NOSG,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.174" (4.42mm) | 16.000" (406.40mm) | 0.357" (9.07mm) | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,SNSAT,DLN
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,SQLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB,TLN
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.190" (4.83mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.190" (4.83mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | 299.21μin (7.60μm) | Clip | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNSAT,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.179" (4.55mm) | 16.000" (406.40mm) | 0.511" (12.98mm) | 299.21μin (7.60μm) | Clip | ||
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|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB,USF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | 299.21μin (7.60μm) | Clip | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,SNB,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||
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|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive |
