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- Voltage - Supply：
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- Supplier Device Package：
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- Ratio - Input:Output：
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- Condizioni selezionate:
Scopri i prodotti 678
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
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NXP USA Inc. |
inchiesta
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- |
-
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MOQ: 96 MPQ: 1
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IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
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Tube | 100ES | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | HSTL，LVPECL | 1 | 0.08611111111111112 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | ||
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NXP USA Inc. |
inchiesta
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- |
-
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MOQ: 250 MPQ: 1
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IC CLK BUFFER 2:3 3GHZ 32LQFP
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Tray | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 32-LQFP | 32-LQFP (7x7) | LVCMOS，LVPECL | 2 | 0.08541666666666665 | Yes/Yes | 3GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | ||
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NXP USA Inc. |
inchiesta
|
- |
-
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MOQ: 75 MPQ: 1
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IC CLK BUFFER 2:4 1GHZ 20TSSOP
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Tube | 100ES | 3.135 V ~ 3.8 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | LVCMOS，LVTTL | 1 | 0.08611111111111112 | No/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | ||
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Microchip Technology |
2,000
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3 giorni |
-
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MOQ: 1000 MPQ: 1
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IC CLK BUFFER 1:1 3GHZ 8MLF
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Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | CML，LVDS，LVPECL | 1 | 0.04236111111111111 | Yes/Yes | 3GHz | Surface Mount | Buffer/Driver | |||
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Microchip Technology |
2,375
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3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:1 3GHZ 8MLF
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Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | CML，LVDS，LVPECL | 1 | 0.04236111111111111 | Yes/Yes | 3GHz | Surface Mount | Buffer/Driver | |||
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Microchip Technology |
2,375
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3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:1 3GHZ 8MLF
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- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | CML，LVDS，LVPECL | 1 | 0.04236111111111111 | Yes/Yes | 3GHz | Surface Mount | Buffer/Driver | |||
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IDT，Integrated Device Technology Inc |
3,000
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3 giorni |
-
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MOQ: 3000 MPQ: 1
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IC CLK BUFFER 2:4 266MHZ 20TSSOP
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Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | LVCMOS，LVTTL，Crystal | 1 | 0.08611111111111112 | No/Yes | 266MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
5,962
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:4 266MHZ 20TSSOP
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Cut Tape (CT) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | LVCMOS，LVTTL，Crystal | 1 | 0.08611111111111112 | No/Yes | 266MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
5,962
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:4 266MHZ 20TSSOP
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- | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | LVCMOS，LVTTL，Crystal | 1 | 0.08611111111111112 | No/Yes | 266MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
3,000
|
3 giorni |
-
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MOQ: 3000 MPQ: 1
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IC CLK BUFFER 2:4 650MHZ 20TSSOP
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Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
5,303
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:4 650MHZ 20TSSOP
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Cut Tape (CT) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
5,303
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3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:4 650MHZ 20TSSOP
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- | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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Linear Technology/Analog Devices |
1,609
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3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER DVR 1:2 12MSOP
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Tube | - | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 12-TSSOP (0.118"，3.00mm Width) | 12-MSOP | CML，CMOS，LVDS，LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 300MHz | Surface Mount | Fanout Buffer (Distribution) | |||
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IDT，Integrated Device Technology Inc |
806
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:4 266MHZ 20TSSOP
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Tube | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | LVCMOS，LVTTL，Crystal | 1 | 0.08611111111111112 | No/Yes | 266MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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Microchip Technology |
580
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:6 5.5GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，32-MLF? | 32-MLF? (5x5) | CML，LVDS，PECL | 1 | 0.08750000000000001 | Yes/Yes | 5.5GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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IDT，Integrated Device Technology Inc |
589
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 2:5 700MHZ 20TSSOP
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Tube | - | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | HCSL，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08680555555555557 | Yes/Yes | 700MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
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Microchip Technology |
1,000
|
3 giorni |
-
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MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:4 3.5GHZ 16MLF
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Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04444444444444445 | Yes/Yes | 3.5GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
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Microchip Technology |
1,154
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 3.5GHZ 16MLF
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Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04444444444444445 | Yes/Yes | 3.5GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
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Microchip Technology |
1,154
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04444444444444445 | Yes/Yes | 3.5GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
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Microchip Technology |
484
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04444444444444445 | Yes/Yes | 3.5GHz | Surface Mount | Fanout Buffer (Distribution)，Translator |
