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Scopri i prodotti 678
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | |
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Microchip Technology |
2,662
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
- | - | 2.375 V ~ 3.63 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVCMOS，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
128
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tube | - | 2.375 V ~ 3.63 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVCMOS，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
127
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tube | - | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | CML，HCSL，LVCMOS，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08611111111111112 | Yes/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 2:5 2GHZ 32MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，32-MLF? | 32-MLF? (5x5) | CML，LVDS，PECL | 1 | 0.08680555555555557 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 2GHZ 32MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，32-MLF? | 32-MLF? (5x5) | CML，LVDS，PECL | 1 | 0.08680555555555557 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 2GHZ 32MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad，32-MLF? | 32-MLF? (5x5) | CML，LVDS，PECL | 1 | 0.08680555555555557 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
146
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16QFN
|
Tube | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML，HSTL，LVCMOS，LVDS，LVTTL，PECL | 1 | 0.04305555555555556 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
|
|
Microsemi Corporation |
550
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 750MHZ 16QFN
|
Tray | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML，HCSL，LVCMOS，LVDS，LVPECL | 1 | 0.04444444444444445 | Yes/Yes | 750MHz | Surface Mount | Fanout Buffer (Distribution) | |||
|
|
Microsemi Corporation |
490
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
LOW SKEW，LOW ADDITIVE JITTER 2
|
Tray | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML，HCSL，LVCMOS，LVDS，LVPECL，SSTL | 1 | 0.09027777777777778 | Yes/Yes | 1.6GHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1000 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | 1 | 0.09375 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | 1 | 0.09375 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
|
|
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | 1 | 0.09375 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
|
|
ON Semiconductor |
217
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 8GHZ 32QFN
|
Tube | GigaComm | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML，LVDS，LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 7GHz | Surface Mount | Fanout Buffer (Distribution)，Data | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 4GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04305555555555556 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
Microchip Technology |
705
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 4GHZ 16MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04305555555555556 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
Microchip Technology |
705
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 4GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，PECL | 1 | 0.04305555555555556 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:4 2GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | 1 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
Microchip Technology |
998
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 2GHZ 16MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | 1 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
Microchip Technology |
998
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 2GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | 1 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution)，Translator | |||
|
|
IDT，Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | HCSL，LVDS，LVHSTL，LVPECL，SSTL | 1 | 0.08680555555555557 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution)，Multiplexer |
