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- Supplier Device Package:
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Scopri i prodotti 678
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
IDT,Integrated Device Technology Inc |
2,230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
Cut Tape (CT) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08680555555555557 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
2,230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
- | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08680555555555557 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC BUFFER DL 1:4 LVPECL 28VFQFPN
|
Tape & Reel (TR) | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) | CML,LVCMOS,LVDS,LVPECL | 2 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
2,220
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER DL 1:4 LVPECL 28VFQFPN
|
Cut Tape (CT) | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) | CML,LVCMOS,LVDS,LVPECL | 2 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
2,220
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER DL 1:4 LVPECL 28VFQFPN
|
- | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) | CML,LVCMOS,LVDS,LVPECL | 2 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 2:12 3GHZ 44MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 44-VFQFN Exposed Pad,44-MLF? | 44-MLF? (7x7) | CML,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 3GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
805
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:12 3GHZ 44MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 44-VFQFN Exposed Pad,44-MLF? | 44-MLF? (7x7) | CML,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 3GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
805
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:12 3GHZ 44MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 44-VFQFN Exposed Pad,44-MLF? | 44-MLF? (7x7) | CML,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 3GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
961
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
961
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 5GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 5GHz | Surface Mount | Fanout Buffer (Distribution),Translator | ||||
Microchip Technology |
730
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 5GHZ 16MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 5GHz | Surface Mount | Fanout Buffer (Distribution),Translator | ||||
Microchip Technology |
730
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 5GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 5GHz | Surface Mount | Fanout Buffer (Distribution),Translator | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:8 4GHZ 32MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
990
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 4GHZ 32MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
990
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 4GHZ 32MLF
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Cypress Semiconductor Corp |
120
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:10 1.5GHZ 32TQFP
|
Tray | - | 2.375 V ~ 3.465 V | 0°C ~ 70°C | 32-TQFP Exposed Pad | 32-TQFP (7x7) | LVPECL | 1 | 0.09027777777777778 | Yes/Yes | 1.5GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Cypress Semiconductor Corp |
196
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:10 1.5GHZ 32TQFP
|
Tray | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 32-TQFP Exposed Pad | 32-TQFP (7x7) | LVPECL | 1 | 0.09027777777777778 | Yes/Yes | 1.5GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Cypress Semiconductor Corp |
111
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 250MHZ 20TSSOP
|
Tube | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | LVCMOS | 1 | 0.08611111111111112 | No/Yes | 250MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer |