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- Voltage - Supply:
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- Supplier Device Package:
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- Ratio - Input:Output:
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Scopri i prodotti 678
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC CLK BUFFER LVPECL 40VFQFPN
|
Tape & Reel (TR) | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) | CML,LVCMOS,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
1,737
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER LVPECL 40VFQFPN
|
Cut Tape (CT) | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) | CML,LVCMOS,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
1,737
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER LVPECL 40VFQFPN
|
- | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) | CML,LVCMOS,LVDS,LVPECL | 1 | 0.09166666666666667 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
37
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTPX 2:1 900MHZ 20TSSOP
|
Tube | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 2 | 0.08402777777777777 | Yes/Yes | 900MHz | Surface Mount | Multiplexer | ||||
IDT,Integrated Device Technology Inc |
70
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08680555555555557 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
80
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 1 | 0.04722222222222222 | Yes/Yes | 1.5GHz | Surface Mount | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
IDT,Integrated Device Technology Inc |
52
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08611111111111112 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
93
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08611111111111112 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:20 2GHZ 64TQFP
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | 1 | 0.09722222222222222 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
93
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 5.5GHZ 32MLF
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 5.5GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
71
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 700MHZ 20SOIC
|
Tube | - | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | HCSL,LVCMOS,LVDS,LVHSTL,LVPECL,LVTTL,SSTL | 1 | 0.08680555555555557 | Yes/Yes | 700MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
96
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:2 266MHZ 14TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 14-TSSOP (0.173",4.40mm Width) | 14-TSSOP | LVCMOS,LVTTL | 1 | 0.08472222222222221 | No/Yes | 266MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
87
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:2 650MHZ 20TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08472222222222221 | Yes/Yes | 650MHz | Surface Mount | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
29
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 48-TQFP | 48-TQFP (7x7) | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.05277777777777778 | Yes/Yes | 500MHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
65
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 85°C | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) | CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.09861111111111111 | Yes/Yes | 500MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
ON Semiconductor |
100
|
3 giorni |
-
|
MOQ: 100 MPQ: 1
|
IC CLK BUFFER 1:4 8GHZ 16QFN
|
Tape & Reel (TR) | GigaComm | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,LVCMOS,LVDS,LVPECL,LVTTL | 1 | 0.04444444444444445 | Yes/Yes | 8GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
ON Semiconductor |
100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 8GHZ 16QFN
|
Cut Tape (CT) | GigaComm | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,LVCMOS,LVDS,LVPECL,LVTTL | 1 | 0.04444444444444445 | Yes/Yes | 8GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
ON Semiconductor |
100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 8GHZ 16QFN
|
- | GigaComm | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,LVCMOS,LVDS,LVPECL,LVTTL | 1 | 0.04444444444444445 | Yes/Yes | 8GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
ON Semiconductor |
71
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 4:2 7GHZ 32QFN
|
Tube | - | 2.37 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,LVDS,LVPECL | 1 | 0.1680555555555555 | Yes/Yes | 7GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer,Translator,Data | ||||
ON Semiconductor |
74
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTIPLEXR 4:2 5GHZ 32QFN
|
Tube | ECLinPS MAX | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,LVDS,LVPECL | 1 | 0.1680555555555555 | Yes/Yes | 5GHz | Surface Mount | Multiplexer,Translator |