fabbricante:
Scopri i prodotti 230
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
97056002
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 12.7X609.6MM
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.500" (12.70mm) - - Adhesive
97056702
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 18.29X609.6MM
Twist 121°C Fingerstock Beryllium Copper - 0.209" (5.31mm) 0.725" (18.42mm) - - Adhesive
97055502
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGRSTOCK BECU ALY 8.64X609.6MM
Twist 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) - - Adhesive
97050008
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
GASKET BECU 15.24X609.6MM
- 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.600" (15.24mm) Tin 299.21μin (7.60μm) Adhesive
97053802
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
GASKET BECU 19.81X609.6MM
- 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 0.780" (19.81mm) - - Adhesive
97094102
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 5.1X609.6MM
- 121°C Fingerstock Beryllium Copper - 0.170" (4.32mm) 0.195" (4.95mm) - - Snap-In
97065002
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 25X406.4MM
- 121°C Fingerstock Beryllium Copper - 0.400" (10.16mm) 0.980" (24.89mm) - - Clip
97092102
Laird Technologies EMI
7
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 6.6X609.6MM
- 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.260" (6.60mm) - - Snap-In
0C97055902
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.300" (7.62mm) Unplated - Adhesive
0C97055502
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.340" (8.64mm) Unplated - Adhesive
0C98055902
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.300" (7.62mm) Unplated - Adhesive
97056102
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 12.7X609.6MM
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.500" (12.70mm) - - Adhesive
6-30T-BD-24
Leader Tech Inc.
243
3 giorni
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.300" (7.62mm) - - -
3-23T-SN-24
Leader Tech Inc.
476
3 giorni
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Tin - Adhesive
97054702
Laird Technologies EMI
164
3 giorni
-
MOQ: 1  MPQ: 1
GASKET BECU 2.29X609.6MM
Twist - - - - - 0.090" (2.29mm) - - -
6-34T-SN-24
Leader Tech Inc.
99
3 giorni
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.340" (8.64mm) Tin - -
4283PA51G02400
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
GK NICU NRSG PU V0 DSH
- - Fabric Over Foam - D-Shape 0.079" (2.00mm) 0.157" (4.00mm) - - Adhesive
4692AC22102400
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
GK NICU PTAF TPE HB DSH
- - Fabric Over Foam - D-Shape 0.142" (3.60mm) 0.252" (6.40mm) - - -
4220AB51K02400
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
GK NICU NRS PU V0 REC
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangle 0.039" (1.00mm) 0.201" (5.10mm) - - -
77001201
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
NOSG,STR,BF
No Snag 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.320" (8.13mm) - - Adhesive