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- Condizioni selezionate:
Scopri i prodotti 230
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU PTAFG PU V0 DSH
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.118" (3.00mm) | 0.358" (9.10mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET FAB/FOAM 10X609.6MM RECT
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 1.000" (25.40mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL BF USF PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU V0 REC
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.157" (4.00mm) | 0.256" (6.50mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU PTAFG PU V0 REC
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.118" (3.00mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL ZNY PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL NIB USF PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 REC
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.256" (6.50mm) | 0.394" (10.00mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU V0 KN
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Knife | 0.106" (2.70mm) | 0.315" (8.00mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,NID,PSA
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USF,PSA
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | - | - | Slot | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG，STR,NIB,PSA
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL ZNC PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.500" (12.70mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,BF,USFT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.210" (5.33mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG STR BF PSA
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No Snag | - | - | - | - | - | 0.319" (8.10mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,SNSAT,PSA
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF,USF,PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT,PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.160" (4.06mm) | - | - | Adhesive |
