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Scopri i prodotti 230
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,SNPB,PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNPB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,CDC,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Cadmium + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,CDY,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT COIL SNB USF PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL ZNC USFT PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.090"H X .150"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.090" (2.29mm) | 0.150" (3.81mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.125"H X. 187"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.125" (3.18mm) | 0.187" (4.75mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.060"H X .394"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 0.394" (10.01mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.125"H X .250"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.125" (3.18mm) | 0.250" (6.35mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL SNSAT PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.060"H X .200"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 0.200" (5.08mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.080"H X .200"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.080" (2.03mm) | 0.200" (5.08mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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TWT COIL SNSAT PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.187"H X .375"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.187" (4.75mm) | 0.375" (9.53mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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HDWE GROUNDING STRIP
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive |
