Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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Attachment Method：

immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Height	Length	Width	Plating	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Height	Length	Width	Plating	Attachment Method
	25-78FSV50-BD-24	Leader Tech Inc.	inchiesta	-	-	0.25 X 0.78 X 0.50 BD 24--FOLDED MOQ: 1 MPQ: 1	0.25 X 0.78 X 0.50 BD 24--FOLDED	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.250" (6.35mm)	24.000" (609.60mm)	0.780" (19.81mm)	Unplated	Adhesive
	16-44UD-BD-16	Leader Tech Inc.	inchiesta	-	-	0.16 X 0.44 BD 16--16-44UD-BD-16 MOQ: 1 MPQ: 1	0.16 X 0.44 BD 16--16-44UD-BD-16	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.016" (0.41mm)	16.000" (406.40mm)	0.440" (11.18mm)	Unplated	Adhesive
	28-49U-BD-16	Leader Tech Inc.	inchiesta	-	-	0.28 X 0.49 BD 16--28-49U-BD-16- MOQ: 1 MPQ: 1	0.28 X 0.49 BD 16--28-49U-BD-16-	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.280" (7.11mm)	16.000" (406.40mm)	0.490" (12.44mm)	Unplated	Adhesive
	23-S-60FSV50-BD-24	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.60 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.23 X 0.60 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Unplated	Adhesive
	23-60FS-BD-24-NTP	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.60 BD 24 NTP--FOLDED SE MOQ: 1 MPQ: 1	0.23 X 0.60 BD 24 NTP--FOLDED SE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Unplated	Adhesive
	25-S-78FSV50-BD-24	Leader Tech Inc.	inchiesta	-	-	0.25 X 0.78 X 0.50 BD 24--FOLDED MOQ: 1 MPQ: 1	0.25 X 0.78 X 0.50 BD 24--FOLDED	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.250" (6.35mm)	24.000" (609.60mm)	0.780" (19.81mm)	Unplated	Adhesive
	25-78FS-BD-24	Leader Tech Inc.	inchiesta	-	-	0.25 X 0.78 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.25 X 0.78 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.250" (6.35mm)	24.000" (609.60mm)	0.780" (19.81mm)	Unplated	Adhesive
	23-S-60FS-BD-24	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.60 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.23 X 0.60 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.230" (5.84mm)	24.000" (609.60mm)	0.600" (15.24mm)	Unplated	Adhesive
	23-76FSC-BD-24	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.76 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.23 X 0.76 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.230" (5.84mm)	24.000" (609.60mm)	0.760" (19.30mm)	Unplated	Adhesive
	25-S-78FS-BD-24	Leader Tech Inc.	inchiesta	-	-	0.25 X 0.78 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.25 X 0.78 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.250" (6.35mm)	24.000" (609.60mm)	0.780" (19.81mm)	Unplated	Adhesive
	23-S-76FSC-BD-24	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.76 BD 24--FOLDED SERIES MOQ: 1 MPQ: 1	0.23 X 0.76 BD 24--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.230" (5.84mm)	24.000" (609.60mm)	0.760" (19.30mm)	Unplated	Adhesive
	SG160160Z-48.00	Leader Tech Inc.	inchiesta	-	-	.160"H X .160"W X 48"L--ROUND--C MOQ: 1 MPQ: 1	.160"H X .160"W X 48"L--ROUND--C	-	-40°C ~ 70°C	Fabric Over Foam	Polyurethane Foam，Nickel-Copper Polyester (NI/CU)	Round	0.160" (4.06mm)	4.00 (1.22m)	0.160" (4.06mm)	-	-
	8-S-45LPAH-BD-16	Leader Tech Inc.	inchiesta	-	-	0.08 X 0.45 BD 16--8-S-45LPAH-BD MOQ: 1 MPQ: 1	0.08 X 0.45 BD 16--8-S-45LPAH-BD	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.080" (2.03mm)	16.000" (406.40mm)	0.450" (11.43mm)	Unplated	Adhesive
	4570PA01H09600	Laird Technologies EMI	inchiesta	-	-	GK NICU PTAFG PU VO REC MOQ: 1 MPQ: 1	GK NICU PTAFG PU VO REC	-	-	-	-	-	-	-	-	-	-
	8200-9020-82	Leader Tech Inc.	inchiesta	-	-	.062"T X .250"W W/PSA--8200-9020 MOQ: 1 MPQ: 1	.062"T X .250"W W/PSA--8200-9020	-	-62°C ~ 260°C	Gasket	Conductive Elastomer	-	-	-	-	-	-
	98013902	Laird Technologies EMI	inchiesta	-	-	CSTR,STR,BF,USFT MOQ: 1 MPQ: 1	CSTR,STR,BF,USFT	-	-	-	-	-	-	-	-	-	-
	98094102	Laird Technologies EMI	inchiesta	-	-	FLX,STR,BF,USFT MOQ: 1 MPQ: 1	FLX,STR,BF,USFT	-	121°C	Fingerstock	Beryllium Copper	-	0.170" (4.32mm)	24.000" (609.60mm)	0.195" (4.95mm)	-	Snap-In
	4B40HC51K00866	Laird Technologies EMI	inchiesta	-	-	GK NICU NRS PU V0 DSH MOQ: 1 MPQ: 1	GK NICU NRS PU V0 DSH	-	-	-	-	-	-	-	-	-	-
	8-19PCI-SS-14.4	Leader Tech Inc.	inchiesta	-	-	FINGESTOCK GASKET-PCI SERIES--8- MOQ: 1 MPQ: 1	FINGESTOCK GASKET-PCI SERIES--8-	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	14.400" (365.76mm)	0.190" (4.83mm)	-	Adhesive
	SG015200R-24	Leader Tech Inc.	inchiesta	-	-	.015"H X .200"W X 24"L--RECTANGU MOQ: 1 MPQ: 1	.015"H X .200"W X 24"L--RECTANGU	-	-40°C ~ 70°C	Fabric Over Foam	Polyurethane Foam，Nickel-Copper Polyester (NI/CU)	Rectangular	0.015" (0.38mm)	24.000" (609.60mm)	0.200" (5.08mm)	-	-

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