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Scopri i prodotti 2,625
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | ||
Wurth Electronics Inc. |
4,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | Phosphor Bronze | - | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | Solder | ||||
Wurth Electronics Inc. |
4,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | Phosphor Bronze | - | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | Solder | ||||
Wurth Electronics Inc. |
4,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | Phosphor Bronze | - | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | Solder | ||||
Leader Tech Inc. |
453
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | Adhesive | ||||
Leader Tech Inc. |
243
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | ||||
Leader Tech Inc. |
476
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | Adhesive | ||||
Laird Technologies EMI |
164
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 2.29X609.6MM
|
Twist | - | - | - | - | - | 24.000" (609.60mm) | 0.090" (2.29mm) | - | - | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCY SPRING SHIELD FINGER
|
- | - | Shield Finger | - | - | 0.079" (2.00mm) | 0.157" (4.00mm) | 0.102" (2.60mm) | - | Solder | ||||
TE Connectivity AMP Connectors |
14,154
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
ACCY SPRING SHIELD FINGER
|
- | - | Shield Finger | - | - | 0.079" (2.00mm) | 0.177" (4.50mm) | 0.102" (2.60mm) | - | Solder | ||||
TE Connectivity AMP Connectors |
14,154
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
ACCY SPRING SHIELD FINGER
|
- | - | Shield Finger | - | - | 0.079" (2.00mm) | 0.177" (4.50mm) | 0.102" (2.60mm) | - | Solder | ||||
TE Connectivity AMP Connectors |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHILED FINGER 1210 EMBOSS PACKIN
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | Solder | ||||
Laird Technologies EMI |
1,231
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | Solder | ||||
Laird Technologies EMI |
1,231
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | Solder | ||||
Leader Tech Inc. |
78
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | Adhesive | ||||
Laird Technologies EMI |
200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||||
Laird Technologies EMI |
261
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||||
Laird Technologies EMI |
261
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||||
Laird Technologies EMI |
53
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
.140X.370 GASKET FABRIC O/ FOAM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | Adhesive | ||||
Leader Tech Inc. |
93
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - |